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CANopen 安全芯片 CSC01 & CSC02

www.can-cia.org
www.can-cia.org

 


CANopen Safety Chip CSC02 Development Kit

 

CANopen Safety Chip CSC01 / CSC02 for safety-relevant Applications up to SIL3, re-certified by TüV Rheinland

The CSC consortium hosted by the CiA GmbH (CAN in Automation) commissioned SYS TEC with the development of the CSC01 as well as CSC02 CANopen safety chip. Both versions of the CANopen safety chip are designed for use in safety-relevant applications up to SIL3 (Safety Integraty Level).

The CSC01 with its permanent firmware is certified by TüV Rheinland (Report No: 968/EL 215.01/04 of July 30, 2004). The CSC01 is based on a 16-bit Renesas M16C (M206NAFGTFP) microcontroller.

The CSC02 chip is certified by the TüV Rheinland Group too. The report of the certification test is released under the number 968/EL 215.02/09 on the date 2009-10-23. The CSC02 is certified for safety-relevant applications up to Safety Integrity Level (SIL) 3, according to IEC 61508, and Safety Category 4, according to EN 954-1.

Both includes the CANopen Safety Protocol in accordance with CiA specification DS 304 and allows a fast integration by the user into its own safety devices.

Customer-specific software components can be loaded later into the CANopen safety chip flash. Accordingly, the CANopen safety chip can be used in a number of applications (for example, emergency stop buttons, safety relays, light curtains or generally as safe CANopen bus interfaces, etc.).

To achieve SIL3 certification for single-processor solutions the international IEC 61508 standard requires a diagnostic coverage level of >99 % within a defined safety cycle time. This high degree of diagnostic coverage requires extensive error detection procedures such as diagnoses of the flash, RAM, CPU register and Op-code.

The particular challenge of the project led to the integration of these error detection mechanisms. The complete development, including accompaniment of the testing by TüV was done by SYS TEC.

Project Phases:

  • Creation of the safety design
  • Testing of the safety design by TüV Rheinland
  • Hardware and software development
  • Verification and validation of the hardware and software
  • Testing of the CSC01 / CSC02 by TüV Rheinland


Particularly close collaboration with the customer and the approval authority was implemented in this project. This was of particular significance to effective and successful project progression. With the experience gained in this project, SYS TEC is predestined to carry out device development based on CANopen Safety Chip and to take on other safety-relevant development projects as well.

 
 
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