广州虹科电子科技有限公司 虹科首页 | 自动化首页   联系销售
德国思泰电子有限公司
产品系列 解决方案 新闻和活动 服务项目 技术支持 公司介绍
 
  解决方案
  铁路应用
  安全应用
    CANopen 安全芯片
  汽车和工程机械
SYS TEC 首页 > 解决方案


CANopen 安全芯片 CSC01 & CSC02

www.can-cia.org
www.can-cia.org

 


CANopen Safety Chip CSC02 Development Kit

 

CANopen Safety Chip CSC01 / CSC02 for safety-relevant Applications up to SIL3, re-certified by TüV Rheinland

The CSC consortium hosted by the CiA GmbH (CAN in Automation) commissioned SYS TEC with the development of the CSC01 as well as CSC02 CANopen safety chip. Both versions of the CANopen safety chip are designed for use in safety-relevant applications up to SIL3 (Safety Integraty Level).

The CSC01 with its permanent firmware is certified by TüV Rheinland (Report No: 968/EL 215.01/04 of July 30, 2004). The CSC01 is based on a 16-bit Renesas M16C (M206NAFGTFP) microcontroller.

The CSC02 chip is certified by the TüV Rheinland Group too. The report of the certification test is released under the number 968/EL 215.02/09 on the date 2009-10-23. The CSC02 is certified for safety-relevant applications up to Safety Integrity Level (SIL) 3, according to IEC 61508, and Safety Category 4, according to EN 954-1.

Both includes the CANopen Safety Protocol in accordance with CiA specification DS 304 and allows a fast integration by the user into its own safety devices.

Customer-specific software components can be loaded later into the CANopen safety chip flash. Accordingly, the CANopen safety chip can be used in a number of applications (for example, emergency stop buttons, safety relays, light curtains or generally as safe CANopen bus interfaces, etc.).

To achieve SIL3 certification for single-processor solutions the international IEC 61508 standard requires a diagnostic coverage level of >99 % within a defined safety cycle time. This high degree of diagnostic coverage requires extensive error detection procedures such as diagnoses of the flash, RAM, CPU register and Op-code.

The particular challenge of the project led to the integration of these error detection mechanisms. The complete development, including accompaniment of the testing by TüV was done by SYS TEC.

Project Phases:

  • Creation of the safety design
  • Testing of the safety design by TüV Rheinland
  • Hardware and software development
  • Verification and validation of the hardware and software
  • Testing of the CSC01 / CSC02 by TüV Rheinland


Particularly close collaboration with the customer and the approval authority was implemented in this project. This was of particular significance to effective and successful project progression. With the experience gained in this project, SYS TEC is predestined to carry out device development based on CANopen Safety Chip and to take on other safety-relevant development projects as well.

 
 
工业通讯

CAN 和 CANopen

接口和网关 Ethernet POWERLINK
模块上系统

开发包

模块按应用分类 模块按架构分类
操作系统层可编程模块 IEC 61131-3 可编程模块 VHDL 可编程模块

自动化部件

控制器

CANopen I/O 模块 开发和配置工具

解决方案

服务项目

技术支持

新闻和活动

 

Email 博客 论坛 点击发送消息给我 

020-3874 3032;13434369840 | sales@hkaco.com | 广州虹科电子科技有限公司 | 版权所有 | 华南理工大学 国家科技园2-504